| Chipscale Robotics
introduces the DAS-01HA Die Attach System for small
volume die attach applications that require high accuracy
in dispense and die attach placement. The placement
accuracy of +/- 0. 5 mil is assured due to the use of
high accuracy closed loop linear motors throughout the
system. The bond line height is programmable due to a
linear glass scale encoder on the Z pick & place
movement. With the motorized film frame stage option and
the pattern recognition option, the DAS-01HS is a cost
effective high accuracy die attach system. The many new
features start with the dispensing of adhesives or
epoxies under software control for time or pressure with
a vacuum pullback. A programmable three axis stage is
used move the dispenser to a customer selected software
pattern. Next, the system's optics views the package
before die placement. A package pedestal stage is
included as an option for the most demanding
applications. Die transfer from a
film frame or waffle pack to the package uses a closed
loop linear motor for high speed and +/- 0.5 mil
placement accuracy. Die placement in Z direction is under
software control or pressure /force control option. The
system places the die prior to dispense and then using
the Z glass scale encoder, places the die after dispense
for correct bond line thickness. Pattern recognition on
both the package and the die along with a motorized X/Y
film frame stage ensures an overall die placement
accuracy of +/- 0.5 mil. GUI is Windows 95 running on a
200 MHz P/C. Software features include specific screens
for operation, set up, and maintenance. In addition to
the standard warranty of 1 year parts and labor,
Chipscale Robotics offers Golden Key warranty for 2 years
parts and labor as an option.
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