| Chipscale Robotics
introduces the DSH 1000 Pick & Place system with
12" of high accuracy movement under software
control. The system can be configured for die sort
applications picking from a wafer film frame and
placement onto waffle/GEL packs, or for part sort from a
JEDEC tray to JEDEC tray. Zoom optics can be ordered
along with small die set up optics as an option. The
gantry motion is a high speed linear motor closed loop to
a glass scale encoder for +/- 0.5 mil accuracy. Several
pedestal and plunge up needle configurations are
available to answer a wide variety of die sizes possible. The standard
output for the die sort is 12-2" waffle/GEL packs or
3-4" waffle/GEL Packs. Wafer mapping software is
available as an option. Pattern recognition electronics
and software for die alignment is available. For part
sorting, standard JEDEC trays are used both for the input
and output. Custom input or output fixtures are also
possible. GUI for the system is Windows 98â running on a
400MHz P/C. Software features include special screens for
operation, set up, and maintenance. In addition to the
standard warranty of one year parts and labor, Chipscale
Robotics offers Golden Key warranty for 2 years parts and
labor as an option.
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