| DSH 3000 Automatic
answers the requirement for a die pick & place system
with high speed motorized motion and high accuracy
placement to +/- 1.0 mil and at a lower cost and smaller
footprint than production systems. The Automatic DSH 3000
requires an operator to manual load a film frame from
2” to 8” wafers (or waffle pack) onto the input
stage. Pick & Place motion is accomplished with a
closed loop high speed linear servo motor to an accuracy
of +/- 1.0 mil. The output stage allows for 32 - 2”
waffle/GEL PAKS, or 8 - 4” waffle/GEL PAKS depending
on customer selection. Each waffle/GEL PAK is
independently removed. The system is
controlled with a 400 MHz Pentium computer, Windows 98
GUI, 1.3 GB Hard Disk, 16 MB RAM, ZIP Drive, Color
Monitor, and two LCD panels. Pattern recognition is used
for inspection of ink marking and minor defects, and can
be used for output placement accuracy. Software features
include specific screen for operators, initial automatic
set up viewing, and maintenance. In addition to the
standard warranty of 1 year, parts and labor, Chipscale
Robotics offers Golden Key warranty for 2 years parts and
labor as an option.
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